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Water mark occurred during the process of Cleaning & Dry on pattern wafer formed as multi film layer for the process of STI (Shallow Trench Isolation)
Water mark occurred during the process of Clean & Dry on pattern wafer formed as deep contact hole layer for the process of Plug poly
Water Mark occurred when the pattern density of surface goes up during the process of Capacitor as a cylinder Type. The capacitor node shift phenomenon is occurred by the water mark formed in former step.